JPS6367356B2 - - Google Patents
Info
- Publication number
- JPS6367356B2 JPS6367356B2 JP15698584A JP15698584A JPS6367356B2 JP S6367356 B2 JPS6367356 B2 JP S6367356B2 JP 15698584 A JP15698584 A JP 15698584A JP 15698584 A JP15698584 A JP 15698584A JP S6367356 B2 JPS6367356 B2 JP S6367356B2
- Authority
- JP
- Japan
- Prior art keywords
- leads
- board
- circuit
- substrate
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 210000002105 tongue Anatomy 0.000 description 5
- 238000009434 installation Methods 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15698584A JPS6135589A (ja) | 1984-07-27 | 1984-07-27 | 回路基板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15698584A JPS6135589A (ja) | 1984-07-27 | 1984-07-27 | 回路基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6135589A JPS6135589A (ja) | 1986-02-20 |
JPS6367356B2 true JPS6367356B2 (en]) | 1988-12-26 |
Family
ID=15639650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15698584A Granted JPS6135589A (ja) | 1984-07-27 | 1984-07-27 | 回路基板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6135589A (en]) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02272792A (ja) * | 1989-04-14 | 1990-11-07 | Asahi Print Kogyo Kk | 端子付フレキシブル印刷配線板の製造方法 |
JPH03122342A (ja) * | 1989-10-05 | 1991-05-24 | Kubota House Kk | 鉄骨建築物の床板固定方法 |
-
1984
- 1984-07-27 JP JP15698584A patent/JPS6135589A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6135589A (ja) | 1986-02-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3012814B2 (ja) | フレキシブルプリント基板 | |
JPS6367356B2 (en]) | ||
JP3614476B2 (ja) | フレキシブル配線部品 | |
JP2857492B2 (ja) | Tabパッケージ | |
JPH0462885A (ja) | フレキシブル回路基板 | |
JPH0145235B2 (en]) | ||
JPS59230279A (ja) | 端子装置の製造方法 | |
JPS6223478B2 (en]) | ||
JP2570581B2 (ja) | 垂直型表面実装半導体パッケージ | |
JPH05310283A (ja) | 電子部品テーピング構体 | |
JPH0537493Y2 (en]) | ||
JPH04243155A (ja) | 混成集積回路装置 | |
JPS6033576Y2 (ja) | プリント板用帯板状ジヤンパ−線 | |
JP2741787B2 (ja) | リードフレーム切断方法 | |
JPH0127551B2 (en]) | ||
JP3102114B2 (ja) | リードフレーム | |
JP2542125Y2 (ja) | 分割回路基板 | |
JPH0121574Y2 (en]) | ||
JP3367511B2 (ja) | テープキャリアの実装方法および液晶表示装置の製造方法 | |
KR0117818Y1 (ko) | 하이브리드 ic의 표면실장형 리드프레임 | |
JPS61107789A (ja) | フレシキブル印刷配線基板およびその製造方法 | |
JPS62240Y2 (en]) | ||
JPS5847710Y2 (ja) | 半導体装置用櫛形リ−ドフレ−ム | |
JPH0562063U (ja) | プリント配線板 | |
JP2001236841A (ja) | 補強板貼付スリットフラットケーブル及びその製造方法 |